| DBC substrates (Direct Bond Copper) are composed of a ceramic insulator, Al2O3 or AlN onto which pure copper metal is attached by a high temperature eutectic melting process and thus tightly and firmly joined to the ceramic. DBC substrates have high thermal conductivity, excellent electrical insulation, excellent current carrying capability, and good mechanical strength, and the thermal expansion coefficient is close to that of silicon，etc. As a new and high capability substrate, DBC substrates have been used widely in electric power and electronic industry. |
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